ptctt series www.vishay.com vishay bccomponents revision:03-mar-14 1 document number: 29088 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 twin vertical smd ptc thermistors for telecom overload protection description the component consists of two high performance ptc ceramics mounted together on an alumina spacer cover and with 4 lead (pb)-free tin plat ed contacts. the terminations are joined to the ag plated ceramics by a high melting solder. marking ? all twin vertical smd ptc s are marked with the last 3-digits of the type number (bcxxx) and a date code (yyww) features ? very small footprint, allowing to increase the number of lines per pcb ? matched pairs in one component, significantly reducing the assembly time ? narrow tracking between the 2 ptcs over a wide temperature range (matching at 85 c: ? 2 x matching at 25 c) ? limited height and weight, used on high speed pick-and- place circuit assembly ? flat pick-up ceramic area for easy placement ? small ceramics for faster response time ? thermal coupled ptcs for enhanced protection ? small and large pitch available ? compliant with the enhanc ed level requirements of itu - k20-21-45 edition 2003 ? suitable for lead (pb)-bearing and lead (pb)-free reflow soldering ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 applications over-temperature/over-load protection: ? telecom - telecommunications infrastructure - pabx - set-top box (s.b.) mounting a flat pick-up area of 30 mm2 and low weight allows for fast placement. no excessive solder paste should be used as no solder or flux can reach the ceramic body during reflow soldering. not suitable for bismuth containing solder. typical soldering 235 c, duration: 5 s (lead (pb)-bearing) 245 c, duration: 5 s (lead (pb)-free) resistance to soldering heat 260 c, duration: 10 s max. note ? all data is measured at 25 c unless otherwise specified quick reference data parameter value unit resistance value at 25 c 10 to 50 ? switching temperature 105 to 130 c maximum voltage (rms) 240 v rms maximum overload current 2.5 to 8.0 a operating temperature range at v max. -40 to 85 c maximum trip time at 1 a 1.2 to 4.0 s weight ~ 1.3 g electrical data r 25 20 % ( ? ) matching ( ?? v max. (v rms ) i nt at i t (ma) max. trip-time at 1 a (s) i max. at v max. (a) i res (2 pieces powered) at v max. (ma) 25 c (ma) 70 c (ma) 85 c (ma) 10 0.5 240 140 85 55 300 4.0 4.0 12.0 20 0.5 240 90 60 40 200 2.0 8.0 12.0 25 0.5 240 100 60 40 200 2.0 4.0 12.0 35 1.0 240 100 60 40 200 1.5 4.0 12.0 50 1.0 240 90 50 35 190 1.2 2.5 12.0
ptctt series www.vishay.com vishay bccomponents revision:03-mar-14 2 document number: 29088 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 electrical characteristics ptc outlines ? footprint ordering information r 25 20 % ( ? ) sap coding small pitch large pitch 10 ptctt95r100gte ptctt95r100gtelar 20 ptctt95r200gte ptctt95r200gtelar 25 ptctt95r250gte ptctt95r250gtelar 35 ptctt95r350gte ptctt95r350gtelar 50 ptctt95r500gte PTCTT95R500GTELAR trip current vs tamb typical 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 - 40 - 20 100 tamb(c) ptc will trip (1 ptc powered) 0 40 20 60 80 ptc will not trip (2 ptc's powered) i hold i trip current deviation factor h s l x (4x) b d t p 1 t 0.1 bcxxx yyww b 1 k 1 k 2 p 0.3 p 2 a b c d e dimensions in millimeters small pitch large pitch l 9.0 0.1 9.0 0.1 t 7.2 0.25 8.4 0.25 h 6.9 0.25 6.9 0.25 b 1.5 0.1 1.5 0.1 b 1 0.9 0.15 0.9 0.15 s 1.25 0.15 1.25 0.15 d 0.22 0.025 0.22 0.025 t 2.3 0.1 2.3 0.1 p 6.5 0.5 6.5 0.5 p 1 2.55 0.15 2.55 0.15 p 2 2.2 0.1 3.45 0.15 x 0.5 0.2 0.5 0.2 k 1 6.0 0.5 7.2 0.5 k 2 5.0 0.5 5.0 0.5 recommended footprint in millimeters small pitch large pitch a2.02.0 b2.42.4 c3.85.0 d3.84.0 e2.71.4
ptctt series www.vishay.com vishay bccomponents revision:03-mar-14 3 document number: 29088 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 packaging tape specifications all tape and reel specifications are in accordance with iec 60 286-3. carrier tape material is non-conductive polystyrene or polycarbonate. reel specifications in millimeters note ? reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres dimensions of blister tape in millimeters small pitch large pitch small pitch large pitch a 0 7.2 0.1 8.4 0.1 d 1 1.5 + 0.1 1.5 + 0.1 b 0 9.3 0.1 9.3 0.1 p 0 4.0 0.1 4.0 0.1 k 0 7.2 0.1 7.2 0.1 p 1 12.0 0.1 12.0 0.1 w 16.0 0.3 16.0 0.3 p 2 2.0 0.1 2.0 0.1 e 1.75 0.1 1.75 0.1 t 0.5 0.05 0.5 0.05 f 7.5 0.1 7.5 0.1 t 1 0.05 0.05 d 0 1.5 + 0.1 1.5 + 0.1 t 2 7.8 max. 7.8 max. reel dimensions in millimeters units per reel tape width a n w 1 w 2 max. 1 000 16 380 64 16.4 20.4 direction of unreeling d 1 p 1 a 0 d 0 p 2 p 0 b 0 w f e k 0 t t 1 t 2 cover tape bcxxx yyww blister tape cumulative pitch error: 0.2 mm over 10 pitches ? cumulative tolerance over 10 holes: 0.2 mm 12.75 + 0.15 0 20.5 n a w 1 w 2 reel
ptctt series www.vishay.com vishay bccomponents revision:03-mar-14 4 document number: 29088 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 soldering conditions this smd thermistor is only suitable fo r reflow soldering, in accordance with jedec j-std-020. soldering processes which can be used are reflow (infrared an d convection heating) and vapour phase. the maxi mum temperature of 260 c during 10 s should not be exceeded and no liquid flux shou ld be allowed to reach the ceramic body. typical examples of soldering proce sses that will provide reliable join ts without damage, are shown below. ? handling precautions because of the nature of ptc ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence componen t behaviour at high temperatures. handling forces applied to th e component should be limited to 5 n in any condition. reflow soldering typical values (solid line) process limits (dotted lines) 2 k/s 130 c 1 8 0 c 215 c 245 c 260 c 10 s 10 s 40 s 300 250 200 150 100 50 0 t (c) 0 250 50 100 150 200 t (s) typical values (solid line) process limits (dotted line) vapour phase soldering external preheating 300 250 200 150 100 50 0 t (c) 0 250 50 100 150 200 t (s) 130 c 1 8 0 c 215 c 20 to 40 s 100 c external preheating internal preheating, e.g. b y infrared, max. 2 k/s forced cooling
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